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UTS-2000 Film Thickness Measurement System

uts-2000-updated

JASCO’s film-thickness measurement system is a nondestructive, non-contact analysis method using the latest interferometric technology to provide rapid film thickness measurements.

Features

System Description

The thickness of the opitaxial layer, substrate, etching (residual layer), liquid crystal cell gap, and other semiconductor layers dramatically impacts semiconductor device performance. Management of layer thickness during the manufacturing process is extremely crucial for production of large yields of stable devices.

JASCO’s film thickness measurement system is a non-destructive, non-contact analysis method using the latest interferometric technology to provide rapid film thickness measurements. Utilizing a proprietary frequency analysis method, the sample interference spectrum is converted to a spatialgram and the film thickness calculated with a high degree of accuracy. This integrated system offers the film thickness measurements required for the exacting standards of the semiconductor industry including high-speed sample mapping; a wide thickness measurement range; and a refined operating environment, supporting a wide range of analysis requirements from process use to R&D. JASCO offers near-infrared and mid-infrared models according to the thickness measurements desired.

JASCO offers near-infrared and midinfrared models according to the thickness measurements desired.

System Features

Wide range of film thickness measurement capability

Enables film thickness (substrate thickness) measurements from 0.25 to 750 µm.

Highly accurate film thickness measurements

Acquisition of precision data using a high-accuracy interferometer and high throughput optics.

Support for multi-wafer cassettes

0ptional automated cassette sampling system, enabling fully automated measurement for wafer cassettes.

Simplified operating system

Various conditions for measurement, mapping, and film thickness calculations are configured as preset recipes and managed in a recipe table. Measurement of film thickness is initiated by simply selecting a required method from the recipe table and clicking the 'Measure' button.

UTS-2000 Specifications

  UTS-2000
Measurement Method FT-IR interference method for film thickness measurements
Measurement Configuration Reflection, Transmission (option)
Objectives Near infrared: Lends objectives (4X) and Cassegrain objectives
(15X, 30X) Mid-infrared: Cassegrain objectives (15X, 30X)
Focus Mechanism 11mm stroke
Sampling Area 20 X 20 to 1200 X 1200 µm
Sample Positioning Verification of measurement area using an integrated CCD camera

Measurement Range/Accuracy

Film Thickness 0.25 to 750 µm (for Si)
Reproducibility ±0.005 µm or less (for Si with identical measurements)

XY Stage

Stage Movement 200 X 200 mm (Other options available)
Minimum Step Size 2 µm

Data Processing Unit

Operating System Windows 7 Professional
Monitor 15-inch LCD
UPS (Uninterruptible Power Supply) Maintains PC and display power for 15 minutes after a power failure
System Control JASCO Spectra Manager software; Optics and X-Y stage control;
Wafer cassette system control (option)

Table

Type Integrated vibration isolation table

Dimensions and Weight

Dimension and weight 1095 (W) x 862 (D) x 1763 (H) mm, Approx. 300 kg (excluding protrusions or optional casste loading system)
Power Consumption 300 VA
Dimensions 1240 X 810 X 1550 mm (excluding protrusions or optional cassette loading system)
Power Requirement 300 VA

Details

Intuitive Software for Film Thickness Measurements

film-thickness-software

1. Measurement Information

Input information for an analysis

2. Fringe or Spatialgram Spectrum

3. Measurement Point Map

4. Film Thickness Distribution Graph

High Measurement Reproducibility

The following table shows consecutive measurement results for a Silicon epitaxial layer.The error of 10 consecutive measurements is less than ±0.001 µm. These figures demonstrate the extremely reproducible film thickness measurement capability.

Reproducibility of consecutive measurements

 

Measurement No.

Measured Value (µm)

Deviation (µm)

1
4.9001
-0.0013
2
4.9014
0.0000
3
4.9010
-0.0004
4
4.9019
0.0005
5
4.9015
0.0001
6
4.9018
0.0004
7
4.9011
-0.0003
8
4.9014
0.0000
9
4.9017
0.0003
10
4.9021
0.0007
Average value (µm): 4.9014
   
Standard deviation (µm): 0.0006
   

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